The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Feb. 11, 2020
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventors:
Kanako Suzuki, Tokyo, JP;
Mikio Okoshi, Tokyo, JP;
Yohei Shirakawa, Tokyo, JP;
Yoshitake Ageishi, Tokyo, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/02 (2006.01); H01R 9/05 (2006.01);
U.S. Cl.
CPC ...
H01R 9/0512 (2013.01); H01R 4/029 (2013.01);
Abstract
A solder with ground bar includes a first unit and a second unit. The first unit includes a first ground bar and a first solder layer attached to one side of the first ground bar. The second unit includes a second ground bar and a second solder layer attached to one side of the second ground bar. The first unit and the second unit are arranged in such a manner that the first solder layer and the second solder layer face each other. The first solder layer and the second solder layer are partially joined together.