The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Aug. 01, 2019
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Hirotaka Obuchi, Kyoto, JP;
Junichi Itai, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01);
Abstract
An LED package includes a substrate with a front surface and a back surface spaced apart from each other in a thickness direction of the substrate. First and second wirings are formed on the substrate. An LED chip is mounted on the front surface of the substrate and electrically connected to the first and second wirings. A sealing resin, such as silicone, covers the LED chip. The substrate is made up of glass cloths laminated in the thickness direction and an impregnated resin, such as acrylic resin, impregnated in the glass cloths.