The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Jun. 05, 2018
Applicant:
Playnitride Inc., Tainan, TW;
Inventors:
Assignee:
PLAYNITRIDE INC., Zhubei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 21/683 (2006.01); H01L 27/15 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/005 (2013.01); H01L 21/6835 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/81 (2013.01); H01L 24/95 (2013.01); H01L 25/50 (2013.01); H01L 33/0093 (2020.05); H01L 24/13 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/11001 (2013.01); H01L 2224/11422 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/95 (2013.01); H01L 2924/12041 (2013.01);
Abstract
A method of manufacturing micro light-emitting element array is disclosed. A transfer substrate and at least one metal bonding pad are provided, and the metal bonding pad is disposed on the transfer substrate. A growth substrate and a plurality of micro light-emitting elements are provided. The micro light-emitting elements are disposed on the growth substrate, and a surface of each of the micro light-emitting elements away from the growth substrate having at least one electrode. The metal bonding pad is molten at a heating temperature, and the electrode is connected to the metal bonding pad. Then, the growth substrate is removed.