The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Nov. 27, 2019
Applicant:
Gachon University of Industry-academic Cooperation Foundation, Seongnam-si, KR;
Inventors:
Seongjae Cho, Seoul, KR;
EunSeon Yu, Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/161 (2006.01); H01L 29/775 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66795 (2013.01); H01L 29/161 (2013.01); H01L 29/66439 (2013.01); H01L 29/775 (2013.01); H01L 29/785 (2013.01);
Abstract
A method for fabricating a semiconductor device is carried out so that silicon nanowires may be made of vertically stacked one or more floating silicon layers, and a silicon buffer layer may be surrounded on each surface of the silicon nanowires with a sufficient thickness, e.g., close to the diameter of the nanowire, and then a silicon germanium shell may be formed on it. Thus, a semiconductor device having a silicon germanium shell channel structure can be fabricated with a uniform thickness even on a bulk silicon substrate using a conventional silicon CMOS process.