The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Dec. 19, 2019
Applicant:
Synaptics Incorporated, San Jose, CA (US);
Inventors:
Tsuyoshi Koga, Tokyo, JP;
Shinya Suzuki, Tokyo, JP;
Naoki Hasegawa, Tokyo, JP;
Naoyuki Narita, Tokyo, JP;
Kiyotaka Miwa, Tokyo, JP;
Kazuhiko Sato, Tokyo, JP;
Yuichi Nakagomi, Tokyo, JP;
Assignee:
Synaptics Incorporated, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 23/3128 (2013.01); H01L 24/05 (2013.01);
Abstract
A semiconductor device comprises a semiconductor substrate, a connection pad, and a bump. The connection pad is connected to the bump and disposed between the semiconductor substrate and the bump. The connection pad has one or more slits.