The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Aug. 14, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Suk Youn Hong, Suwon-si, KR;
Han Su Park, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/561 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 2223/6677 (2013.01);
Abstract
An electronic element module includes: a substrate including ground wirings; at least one electronic element mounted on a first surface of the substrate; a sealing portion embedding the at least one electronic element therein and disposed on the substrate; connection conductors partially disposed on side surfaces of the substrate and having lower ends connected to the ground wirings; and a shielding portion disposed along the sealing portion, and connected to the connection conductors.