The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Jan. 30, 2019
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventor:
Tatsuo Nishizawa, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/50 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/492 (2006.01); H01L 25/07 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/492 (2013.01); H01L 25/072 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01);
Abstract
A semiconductor device includes a conductive plate to which a semiconductor element is mounted on a front surface; a sealing resin internally encapsulating at least the front surface of the conductive plate and the semiconductor element; and an external connection terminal connected to the conductive plate and exposed outside the sealing resin. The external connection terminal has a buckling portion or an expanding and contracting portion. The external connection terminal may have a notch and the buckling portion is a part having the notch.