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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10991644 B1

PDFFull Text
Date of Patent:
Apr. 27, 2021

Filed:

Aug. 22, 2019

Integrated circuit package having a low profile

Applicant:

Allegro Microsystems, Llc, Manchester, NH (US);

Inventors:

Paul A. David, Bow, NH (US);

Harry Chandra, Phoenix, AZ (US);

William P. Taylor, Amherst, NH (US);

Assignee:

Allegro MicroSystems, LLC, Manchester, NH (US);

Attorney:

Daly Crowley Mofford & Durkee, LLP

Primary Examiner:

David A Zarneke

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 43/06 (2006.01); H01L 43/12 (2006.01); H01L 25/065 (2006.01); G01R 33/07 (2006.01); G01R 33/00 (2006.01); H01L 31/0203 (2014.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); G01R 33/0047 (2013.01); G01R 33/07 (2013.01); H01L 21/565 (2013.01); H01L 23/31 (2013.01); H01L 23/3135 (2013.01); H01L 23/49541 (2013.01); H01L 25/0652 (2013.01); H01L 31/0203 (2013.01); H01L 43/06 (2013.01); H01L 43/12 (2013.01);
Abstract

A method of providing a sensor IC package can include applying a film to a leadframe having first and second surfaces, mounting at least one component to the film, and applying a pre-mold material to cover at least a portion of the leadframe and the passive component while leaving a first side of the leadframe exposed. The film can be removed and a die attached to the first side of the leadframe. At least one electrical connection can be formed between the die and the leadframe. The assembly of the die, the leadframe, and the pre-mold material can be encapsulated with a final mold material to provide a low profile IC package.

Find Patent Forward Citations

David, Paul. (2021). Integrated circuit package having a low profile (U.S. Patent No. 10991644). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10991644

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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