The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Feb. 04, 2019
Johnson Electric International Ag, Murten, CH;
Chiping Sun, Hong Kong, CN;
Shinghin Yeung, Hong Kong, CN;
Haibo Jiang, Shenzhen, CN;
Qiubao Wang, Shenzhen, CN;
Enhui Wang, Shenzhen, CN;
JOHNSON ELECTRIC INTERNATIONAL AG, Murten, CH;
Abstract
An IC includes a bare die and a multiplexed pin. The multiplexed pin is electrically connected to first and second switch circuits, the first and second switch circuits are respectively connected to first and second circuit modules disposed on the bare die and control a connection between the first and second circuit modules and the multiplexed pin, the first switch circuit is connected to a first die pad by a metal layer trace within the bare die, the second switch circuit is connected to a second die pad by a metal layer trace within the bare die, and the first and second die pads are connected to the multiplexed pin through a bond wire respectively. The bare die with a larger number of die pads can be packaged into an IC package with a smaller number of chip pins.