The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
May. 17, 2018
Applicant:
Essex Furukawa Magnet Wire Japan Co., Ltd., Tokyo, JP;
Inventors:
Keisuke Ikeda, Tokyo, JP;
Hideo Fukuda, Tokyo, JP;
Assignee:
ESSEX FURUKAWA MAGNET WIRE JAPAN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/02 (2006.01); H01B 7/30 (2006.01); H01B 13/00 (2006.01); H01B 7/00 (2006.01); H01B 13/14 (2006.01); H01B 3/42 (2006.01); H01R 4/02 (2006.01); H01R 4/70 (2006.01);
U.S. Cl.
CPC ...
H01B 7/303 (2013.01); H01B 7/00 (2013.01); H01B 7/02 (2013.01); H01B 7/0225 (2013.01); H01B 7/0275 (2013.01); H01B 13/00 (2013.01); H01B 13/0013 (2013.01); H01B 13/14 (2013.01); H01B 3/427 (2013.01); H01R 4/023 (2013.01); H01R 4/70 (2013.01);
Abstract
An assembled wire, having: an assembled conductor composed of a plurality of conductor strands each having a rectangular cross-section, stacked and arranged each other across an interlayer insulating layer; an insulating outer layer that coats the assembled conductor including the interlayer insulating layer; and an adhesion layer composed of a thermoplastic resin having a thickness of 3 μm or more and 10 μm or less between the assembled conductor and the insulating outer layer.