The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

Dec. 21, 2018
Applicant:

Tpk Touch Solutions (Xiamen) Inc., Xiamen, CN;

Inventors:

Ching-Shan Lin, Tainan, TW;

Chun-Yan Wu, Fuzhou, CN;

Chung-Chin Hsiao, Hsinchu, TW;

Hwai-Hai Chiang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); G06F 3/047 (2006.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1652 (2013.01); G06F 1/1643 (2013.01); G06F 3/041 (2013.01); G06F 3/047 (2013.01); G06F 3/044 (2013.01); G06F 3/0412 (2013.01); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04107 (2013.01);
Abstract

A manufacturing method of touch sensors is provided. A flexible touch sensing component can be formed on a first substrate by a release layer. Next, the flexible touch sensing component is transferred to a second substrate after a releasing step. Furthermore, by the support of the second substrate, the flexible touch sensing component can be processed and then adhered a desired cover. After releasing the second substrate from the flexible touch sensing component, the touch sensor is formed.


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