The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

Oct. 04, 2018
Applicant:

Premium Aerotec Gmbh, Augsburg, DE;

Inventors:

Julian Kuntz, Augsburg, DE;

Steffen Buerkner, Munich, DE;

Andrey Angelov, Augsburg, DE;

Assignee:

PREMIUM AEROTEC GMBH, Augsburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 19/04 (2006.01); C09J 7/35 (2018.01); C09J 7/21 (2018.01); B32B 7/12 (2006.01); B32B 27/18 (2006.01); B65B 51/02 (2006.01);
U.S. Cl.
CPC ...
G01N 19/04 (2013.01); B32B 7/12 (2013.01); B32B 27/18 (2013.01); B65B 51/02 (2013.01); C09J 7/21 (2018.01); C09J 7/35 (2018.01); C09J 2301/304 (2020.08); C09J 2400/263 (2013.01); C09J 2463/00 (2013.01); G01N 2203/0091 (2013.01);
Abstract

An adhesive film and arrangement and method for verifying an adhesive attachment. A mechanical strength of adhesive film structure is matched to a target binding force of a bond produced using the film where when the film is pulled from the substrate or a material layer with peeling stress on the bond for verification of adhesive attachment, the film fails with exceedance of the mechanical strength of the structure when the strength of the bond attains or exceeds the target binding force, and the adhesive film when pulled apart does not fail when bond strength does not attain target binding force. An arrangement is disclosed for verification of adhesive attachment, having a substrate, a component bonded to the substrate by an adhesive film, and at least one test section. The test section is formed by projection of the film across an edge of the component bonded to the substrate, the projection being bonded to regions of the substrate.


Find Patent Forward Citations

Loading…