The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Apr. 24, 2018
Sensirion Ag, Stäfa, CH;
Werner Hunziker, Stäfa, CH;
David Pustan, Stäfa, CH;
Matthias Boeller, Stäfa, CH;
Stephan Braun, Stäfa, CH;
SENSIRION AG, Stafa, CH;
Abstract
A sensor package comprises a sensor chip () with a sensitive element () exposed to an environment of the sensor package, and contact pads () for electrically contacting the sensor package. Electrical connections () are applied between the sensor chip () and the contact pads (). A molding compound () at least partially encloses the sensor chip () and the contact pads (). A unit () consisting of the sensor chip () and optionally of a die pad () supporting the sensor chip () is arranged such that a top surface (ts) of the unit () does not protrude from a level defined by a top surface (ts) of the contact pads (), and a bottom surface (bs) of the unit () does not protrude from a level defined by a bottom surface (bs) of the contact pads ().