The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

Aug. 16, 2019
Applicants:

Claudio Cinquemani, Cologne, DE;

Detlef Frey, Niederkassel, DE;

Hans-georg Geus, Niederkassel, DE;

Peter Schlag, Troisdorf, DE;

Inventors:

Claudio Cinquemani, Cologne, DE;

Detlef Frey, Niederkassel, DE;

Hans-Georg Geus, Niederkassel, DE;

Peter Schlag, Troisdorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D01D 5/088 (2006.01); B29C 48/05 (2019.01); D01F 6/06 (2006.01); D01D 7/00 (2006.01); D04H 3/005 (2012.01); D01D 5/098 (2006.01); D04H 3/16 (2006.01); B29L 31/00 (2006.01); B29D 99/00 (2010.01);
U.S. Cl.
CPC ...
D01D 5/088 (2013.01); D01D 5/0985 (2013.01); D01D 7/00 (2013.01); D01F 6/06 (2013.01); D04H 3/005 (2013.01); D04H 3/16 (2013.01); B29C 48/05 (2019.02); B29D 99/0078 (2013.01); B29L 2031/731 (2013.01);
Abstract

An apparatus for continuously making a spunbond web of filaments comprises a spinneret, a cooling chamber into which process air for can be introduced for the purpose of cooling the filaments, a monomer suction device between a spinneret and cooling chamber, a stretcher and a deposition device for depositing the filaments of the spunbond web. The cooling chamber is divided into two cooling compartments, and process air can be suctioned out from a first upper cooling compartment at a volumetric flow rate (V) to a monomer suction device. Process air exits from the first upper cooling compartment at a volumetric flow rate (V) into a second lower cooling compartment and from the first upper cooling compartment at a volumetric flow rate (V) into a second lower cooling compartment. A ratio (V/V) is 0.1 to 0.35.


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