The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Sep. 02, 2016
Dankook University Cheonan Campus Industry Academic Cooperation Foundation, Cheonan-si, KR;
Yong Choi, Chungcheongnam-do, KR;
Abstract
Disclosed is a method of manufacturing various alloy thin films, in which nano-scale cracks are controlled, with desired compositions using an ultrasonic pulse electroforming process. The method includes a step of forming a multilayer that includes two or more different thin metal film layers, in which nano-scale cracks due to hydrogen generation are controlled, a step of ultimately facilitating interdiffusion by controlling the thickness of the multilayer to a nano-scale thickness through pulse application and the number of layers forming the multilayer, and controlling an alloy to have a desired composition through heat treatment, and a step of thermally treating the multilayer such that interdiffusion sufficiently occurs among the two or more different thin metal film layers. The step of thermally treating may be carried out along with rolling, whereby very fine cracks may be removed by compression and, accordingly, alloy foils having various compositions may be economically produced. A layer number and thickness of the multilayer may be controlled to a nano-sized thickness by applying various types of pulses or by connecting a plurality of electrolytic cells in series and stepwise or repeatedly transferring adding an electroforming layer to the electrolytic cells under a DC application condition.