The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

Mar. 06, 2017
Applicant:

Mitsubishi Engineering-plastics Corporation, Tokyo, JP;

Inventors:

Ryusuke Yamada, Hiratsuka, JP;

Takahiro Takano, Hiratsuka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 77/06 (2006.01); C08L 23/02 (2006.01); C08K 7/14 (2006.01); C08K 3/26 (2006.01); C08L 91/06 (2006.01); C08K 5/01 (2006.01); C08K 3/04 (2006.01);
U.S. Cl.
CPC ...
C08L 77/06 (2013.01); C08K 3/26 (2013.01); C08K 5/01 (2013.01); C08K 7/14 (2013.01); C08L 23/02 (2013.01); C08L 91/06 (2013.01); C08K 3/04 (2013.01); C08K 2003/265 (2013.01); C08K 2201/005 (2013.01); C08L 2205/24 (2013.01);
Abstract

Provided is a polyamide resin composition capable of yielding highly abrasion-resistant molded article, while keeping high mechanical strength, and, a molded article using the polyamide resin composition. The polyamide resin composition contains (A) polyamide resin, (B) polyolefin wax, and (C) at least one metal salt selected from alkali metal salt and alkali earth metal salt, and the (A) polyamide resin contains (a-1) semiaromatic polyamide resin.


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