The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

Oct. 27, 2017
Applicant:

Kyoraku Co., Ltd., Kyoto, JP;

Inventors:

Takaaki Someya, Kanagawa, JP;

Takeru Sano, Kanagawa, JP;

Yoshinori Ono, Kanagawa, JP;

Tadatoshi Tanji, Kanagawa, JP;

Assignee:

KYORAKU CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/12 (2006.01); C08J 5/04 (2006.01); C08K 5/14 (2006.01); C08K 7/02 (2006.01); B29C 44/00 (2006.01); C08J 9/12 (2006.01); C08J 9/04 (2006.01); B29C 49/00 (2006.01);
U.S. Cl.
CPC ...
C08J 5/042 (2013.01); B29C 44/00 (2013.01); B29C 49/00 (2013.01); C08J 5/043 (2013.01); C08J 9/04 (2013.01); C08J 9/12 (2013.01); C08K 5/14 (2013.01); C08K 7/02 (2013.01); C08L 23/12 (2013.01); C08J 2201/03 (2013.01); C08J 2323/12 (2013.01); C08L 2203/14 (2013.01);
Abstract

Provided is a resin for foam molding excellent in foam molding property and low-temperature impact resistance. According to the present invention, provided is a resin for foam molding including a component A, a component B and a component C. The component A is a long-chain branched homopolypropylene, the component B is a long-chain branched block polypropylene, the component C is a polyethylene-based elastomer, and when a total of the components A to C is 100 parts by mass, content of the component A is 20 to 70 parts by mass, content of the component B is 20 to 70 parts by mass, and content of the component C is 1 to 20 parts by mass.


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