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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10988569 B1

PDFFull Text
Date of Patent:
Apr. 27, 2021

Filed:

Aug. 03, 2016

Curable composition and cured product from same

Applicant:

Daicel Corporation, Osaka, JP;

Inventors:

Takeshi Fujikawa, Himeji, JP;

Sadayuki Fukui, Himeji, JP;

Assignee:

DAICEL CORPORATION, Osaka, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Mathieu D Vargot

Int. Cl.
CPC ...
C08G 59/24 (2006.01); B29C 39/02 (2006.01); B29D 11/00 (2006.01); G02B 1/04 (2006.01); B29C 39/24 (2006.01); C08G 65/18 (2006.01); C08L 63/00 (2006.01); B29C 39/26 (2006.01); B29C 39/36 (2006.01); B29C 39/38 (2006.01); C08G 59/68 (2006.01); B29K 63/00 (2006.01); B29K 105/24 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
C08G 59/24 (2013.01); B29C 39/02 (2013.01); B29C 39/24 (2013.01); B29C 39/26 (2013.01); B29C 39/36 (2013.01); B29C 39/38 (2013.01); C08G 59/245 (2013.01); C08G 59/687 (2013.01); C08G 65/18 (2013.01); C08L 63/00 (2013.01); G02B 1/04 (2013.01); G02B 1/041 (2013.01); B29K 2063/00 (2013.01); B29K 2105/24 (2013.01); B29L 2011/0016 (2013.01);
Abstract

Provided is a curable composition which has excellent curability, less causes silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition according to the present invention is a curable composition for production of an optical component by molding using silicone molds. The curable composition contains curable compounds and a cationic initiator. The curable compounds include (A) a cycloaliphatic epoxy compound and (B) an oxetane compound. The oxetane compound (B) is present in a content of 10 to 45 weight percent of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 90 weight percent or more is a compound or compounds having a solubility parameter of 9.0 (cal/cm)or more as determined at 25° C. by the Fedors' method.

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