The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

Aug. 03, 2016
Applicant:

Daicel Corporation, Osaka, JP;

Inventors:

Takeshi Fujikawa, Himeji, JP;

Sadayuki Fukui, Himeji, JP;

Assignee:

DAICEL CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/24 (2006.01); B29C 39/02 (2006.01); B29D 11/00 (2006.01); G02B 1/04 (2006.01); B29C 39/24 (2006.01); B29C 33/40 (2006.01); C08G 59/38 (2006.01); C08G 59/68 (2006.01); C08G 65/18 (2006.01); C08G 59/22 (2006.01); B29C 39/26 (2006.01); B29C 39/36 (2006.01); B29C 39/38 (2006.01); B29C 35/08 (2006.01); B29C 33/00 (2006.01); B29K 63/00 (2006.01); B29K 105/24 (2006.01); B29L 11/00 (2006.01); G02B 3/08 (2006.01);
U.S. Cl.
CPC ...
C08G 59/24 (2013.01); B29C 33/405 (2013.01); B29C 39/02 (2013.01); B29C 39/24 (2013.01); B29C 39/26 (2013.01); B29C 39/36 (2013.01); B29C 39/38 (2013.01); C08G 59/226 (2013.01); C08G 59/245 (2013.01); C08G 59/38 (2013.01); C08G 59/687 (2013.01); C08G 65/18 (2013.01); G02B 1/04 (2013.01); G02B 1/041 (2013.01); B29C 35/0888 (2013.01); B29C 2033/0005 (2013.01); B29C 2035/0827 (2013.01); B29C 2793/009 (2013.01); B29C 2793/0027 (2013.01); B29D 11/00269 (2013.01); B29D 11/00298 (2013.01); B29K 2063/00 (2013.01); B29K 2105/24 (2013.01); B29K 2883/00 (2013.01); B29L 2011/005 (2013.01); G02B 3/08 (2013.01);
Abstract

Provided is a curable composition which has chargeability into silicone molds and curability at excellent levels, less causes the silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition according to the present invention contains curable compounds and a cationic initiator and is used for production of an optical component by molding using silicone molds. The curable compounds include (A) a cycloaliphatic epoxy compound in a content of 10 weight percent or more of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 10 to 50 weight percent is a curable compound or compounds having a molecular weight of 400 or more.


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