The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

Sep. 18, 2017
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Arne Dannenberg, Metzingen, DE;

Torsten Kramer, Wannweil, DE;

Joachim Fritz, Tuebingen, DE;

Thomas Friedrich, Moessingen-Oeschingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 7/00 (2006.01); G01L 19/14 (2006.01); G01L 19/00 (2006.01); G01L 9/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00325 (2013.01); B81B 7/0048 (2013.01); B81B 7/0061 (2013.01); G01L 9/0042 (2013.01); G01L 9/0045 (2013.01); G01L 19/0076 (2013.01); G01L 19/146 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81C 2201/0112 (2013.01); B81C 2201/0132 (2013.01); B81C 2203/035 (2013.01);
Abstract

A method for producing a micromechanical pressure sensor. The method includes: providing a MEMS wafer having a silicon substrate and a first cavity developed therein underneath a sensor diaphragm; providing a second wafer; bonding the MEMS wafer to the second wafer; and exposing a sensor core from the rear side; a second cavity being formed in the process between the sensor core and the surface of the silicon substrate, and the second cavity being developed with the aid of an etching process which is carried out using etching parameters that are modified in a defined manner.


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