The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Jan. 19, 2015
Teijin Limited, Osaka, JP;
Takaya Fujii, Matsuyama, JP;
Shuhei Suzuki, Matsuyama, JP;
Hodaka Yokomizo, Matsuyama, JP;
Hidenori Aoki, Matsuyama, JP;
Teijin Limited, Osaka, JP;
Abstract
A molding material for a multi-layered structure, includes a thermoplastic resin layer (X) including carbon fibers (A) having a weight-average fiber length of 0.01 mm to less than 3 mm; and a thermoplastic resin layer (Y) including carbon fibers (B) having a weight-average fiber length of 3 mm to 100 mm, in which a density parameter Pof the thermoplastic resin layer (Y) expressed by the following Equation (1) is 1×10to less than 1×10, and in which a density parameter Pof the thermoplastic resin layer (X) expressed by the following Equation (1) is more than 1×10:=()/  (1),