Dies for forming a part and associated systems and methods

Abstract

Disclosed herein is a die for forming a part. The die comprises a base, comprising a heat-platen interface surface and a part interface surface, and wherein the heat-platen interface surface and the part interface surface are separated by a thickness of the base. The die also comprises inserts, embedded within and circumferentially closed by the base, spaced apart from each other, and extending in a first direction from the heat-platen interface surface toward the part interface surface. The base is made of a first material having a first thermal conductivity. The inserts are made of a second material having a second thermal conductivity. The first thermal conductivity is different than the second thermal conductivity.