The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Mar. 12, 2018
Fuji Manufacturing Co., Ltd., Tokyo, JP;
FUJI MANUFACTURING CO., LTD., Tokyo, JP;
Abstract
The present invention is directed to provide a method of forming dimples comparatively simply on a surface of hard-brittle materials such as ceramics by post-processing. In the method, substantially spherical ejection particles having a median diameter d50 of from 1 μm to 20 μm are ejected together with a compressed gas at an ejection pressure of from 0.01 MPa to 0.7 MPa against a dimple formation region which is a region where dimples are to be formed on a surface of an article made from a hard-brittle material or a surface of an article having a surface coated with a coating layer of a hard-brittle material, or the like so as to form dimples on the surface of the hard-brittle material by plastic deformation without occurrences of breaks or cracks.