The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2021
Filed:
Oct. 16, 2018
Applicant:
Ingersoll-rand Industrial U.s., Inc., Davidson, NC (US);
Inventors:
Joshua O. Johnson, Allentown, PA (US);
Vairavasundaram Swaminathan, Bangalore, IN;
Justin T. Chellew, Bethleham, PA (US);
Assignee:
INGERSOLL-RAND INDUSTRIAL U.S., INC., Davidson, NC (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 3/28 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H05K 1/021 (2013.01); H05K 1/186 (2013.01); H05K 3/284 (2013.01); H05K 7/20463 (2013.01); H05K 2201/10409 (2013.01);
Abstract
The present invention provides a single-piece printed circuit board heat sink and encapsulation device configured to efficiently dissipate heat away from the printed circuit board, along with associated methodology for dispersing heat from a printed circuit board.
Johnson, Joshua. (2021). Heat sink tray for printed circuit boards (U.S. Patent No. 10986723). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10986723
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile