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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10986722 B1

PDFFull Text
Date of Patent:
Apr. 20, 2021

Filed:

Nov. 15, 2019

High performance heat sink for double sided printed circuit boards

Applicant:

Goodrich Corporation, Charlotte, NC (US);

Inventors:

Philippe Lapujade, Chandler, AZ (US);

Anthony Bartels, Glendale, AZ (US);

Andre Hessling von Heimendahl, Koblenz, DE;

Assignee:

GOODRICH CORPORATION, Charlotte, NC (US);

Attorney:

Snell & Wilmer LLP

Primary Examiner:

Jacob R Crum

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); F21S 43/19 (2018.01); F21V 23/00 (2015.01); F21S 45/47 (2018.01); F21S 43/14 (2018.01); B64D 47/02 (2006.01); H05K 1/18 (2006.01); F21Y 115/10 (2016.01); F21W 107/30 (2018.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); B64D 47/02 (2013.01); F21S 43/14 (2018.01); F21S 43/195 (2018.01); F21S 45/47 (2018.01); F21V 23/003 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); B64D 2203/00 (2013.01); F21W 2107/30 (2018.01); F21Y 2115/10 (2016.08); H05K 2201/066 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/10545 (2013.01);
Abstract

A system for transferring heat from printed circuit boards (PCBs) with light emitting diodes (LEDs) includes a PCB having a first side and a second side and configured to be coupled to an exterior portion of an aircraft. The system further includes a LED located on the first side of the PCB. The system further includes a first metal strip located on the second side of the PCB. The system further includes a heat sink configured to contact the first metal strip to dissipate heat from the PCB.

Find Patent Forward Citations

Quick Actions:

Lapujade, Philippe. (2021). High performance heat sink for double sided printed circuit boards (U.S. Patent No. 10986722). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10986722

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