The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Sep. 13, 2017
Applicants:

Autonetworks Technologies, Ltd., Mie, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Hideyuki Kuboki, Mie, JP;

Hiroki Hirai, Mie, JP;

Makoto Higashikozono, Mie, JP;

Akihisa Hosoe, Osaka, JP;

Yoshiyuki Hirose, Osaka, JP;

Akihiro Nagafuchi, Osaka, JP;

Tomoharu Takeyama, Osaka, JP;

Eiichi Kobayashi, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 10/613 (2014.01); H01M 10/6554 (2014.01); H01M 10/6569 (2014.01); H01M 10/6555 (2014.01); H01M 10/653 (2014.01); H01M 10/6567 (2014.01); H01M 10/647 (2014.01); H01M 10/6566 (2014.01); H01M 10/6557 (2014.01); H01M 10/6551 (2014.01); H01M 10/655 (2014.01); H01M 10/0525 (2010.01); H01M 10/34 (2006.01); H01M 10/625 (2014.01); H01G 11/18 (2013.01); H01G 11/80 (2013.01); H01G 11/12 (2013.01); H01M 10/04 (2006.01); H01M 10/6568 (2014.01); H01M 10/052 (2010.01); H01M 50/20 (2021.01); H01M 50/183 (2021.01);
U.S. Cl.
CPC ...
H01M 10/613 (2015.04); H01G 11/12 (2013.01); H01G 11/18 (2013.01); H01G 11/80 (2013.01); H01M 10/0413 (2013.01); H01M 10/052 (2013.01); H01M 10/0525 (2013.01); H01M 10/345 (2013.01); H01M 10/625 (2015.04); H01M 10/647 (2015.04); H01M 10/653 (2015.04); H01M 10/655 (2015.04); H01M 10/6551 (2015.04); H01M 10/6554 (2015.04); H01M 10/6555 (2015.04); H01M 10/6557 (2015.04); H01M 10/6566 (2015.04); H01M 10/6567 (2015.04); H01M 10/6568 (2015.04); H01M 10/6569 (2015.04); H01M 50/20 (2021.01); H01M 50/183 (2021.01); H01M 2220/20 (2013.01);
Abstract

A power storage module includes: a power storage element; a cooling member that is stacked on the power storage element and has a sealing body hermetically sealing a coolant and an absorption member disposed in the sealing body to absorb the coolant; and a heat transfer plate that is stacked on the power storage element with the cooling member sandwiched therebetween. The heat transfer plate is provided with protrusion portions that protrude to the cooling member side.


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