The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Jan. 06, 2020
Applicant:

Coretronic Corporation, Hsin-Chu, TW;

Inventors:

Shih-Yi Lin, Hsin-Chu, TW;

Wen-Hsun Yang, Hsin-Chu, TW;

Yu-An Huang, Hsin-Chu, TW;

Assignee:

Coretronic Corporation, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/60 (2010.01); H01L 33/54 (2010.01); F21V 8/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); G02B 6/0036 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01);
Abstract

A light source module including a substrate and a plurality of light emitting units is provided. The light emitting units are disposed on a surface of the substrate and each light emitting unit includes a first light emitting device, a second light emitting device, a first reflective element, a second reflective element and a package structure. The first reflective element and the second reflective element are respectively overlapped with the first light emitting device and the second light emitting device along a direction being perpendicular to the surface of the substrate. The package structure is disposed between the first reflective element, the second reflective element, the first light emitting device and the second light emitting device. The package structure includes a main body portion and a first recess. The main body portion covers the first light emitting device and the second light emitting device.


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