The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2021
Filed:
Nov. 20, 2017
Applicant:
Dexerials Corporation, Tokyo, JP;
Inventors:
Assignee:
DEXERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01B 1/22 (2006.01); H01B 5/14 (2006.01); H01R 12/61 (2011.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01B 1/22 (2013.01); H01B 5/14 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01R 12/61 (2013.01); H01L 23/3733 (2013.01); H01L 23/3737 (2013.01); H01L 2224/294 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29357 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83203 (2013.01); H01L 2924/2075 (2013.01); H05K 2201/09945 (2013.01); H05K 2203/0278 (2013.01);
Abstract
An anisotropic conductive film has a structure in which high hardness conductive particles having a 20% compression elastic modulus of 8000 to 28000 N/mmand low hardness conductive particles having a lower 20% compression elastic modulus than that of the high hardness conductive particles are dispersed as conductive particles in an insulating resin layer. The number density of all the conductive particles is 6000 particles/mmor more, and the number density of the low hardness conductive particles is 10% or more of that of all the conductive particles.