The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Mar. 28, 2017
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Yoshinobu Sasaki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 27/02 (2006.01); H03F 1/56 (2006.01); H03F 3/21 (2006.01); H01L 23/60 (2006.01); H01L 23/64 (2006.01); H01L 29/872 (2006.01); H01L 29/861 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 49/02 (2006.01); H03F 1/52 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/60 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 24/48 (2013.01); H01L 25/16 (2013.01); H01L 27/0248 (2013.01); H01L 27/0255 (2013.01); H01L 27/0288 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H01L 29/861 (2013.01); H01L 29/872 (2013.01); H03F 1/523 (2013.01); H03F 1/565 (2013.01); H03F 3/21 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/30111 (2013.01); H03F 2200/222 (2013.01); H03F 2200/318 (2013.01); H03F 2200/387 (2013.01); H03F 2200/444 (2013.01); H03F 2200/451 (2013.01);
Abstract

The present invention includes a first semiconductor chip, a second semiconductor chip, a first inductor, a second inductor, a second capacitor, protective diodes, and a third inductor. A field effect transistor includes a gate terminal, a drain terminal, and a source terminal connected to a ground terminal. The second semiconductor chip includes an input terminal and an output terminal connected in a direct current manner, and includes a first capacitor connected to the input terminal and to the ground terminal. The first inductor is connected between the output terminal and the gate terminal. The second inductor includes a first terminal connected to the input terminal. The second capacitor is connected between a second terminal of the second inductor and the ground terminal. Protective diodes are connected in series in a forward direction, and each has a cathode, and an anode connected to the ground terminal. The third inductor is connected between the cathode and the second terminal.


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