The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Dec. 11, 2018
Applicant:

SK Hynix Inc., Icheon-si, KR;

Inventors:

Ki Jun Sung, Cheongju-si, KR;

Ha Gyeong Song, Seongnam-si, KR;

Assignee:

SK hynix Inc., Icheon-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5381 (2013.01); H01L 23/29 (2013.01); H01L 23/3114 (2013.01); H01L 23/5384 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 2224/02373 (2013.01);
Abstract

A stack package includes a plurality of sub-packages vertically stacked. Each of the sub-packages includes a bridge die having a plurality of vertical interconnectors and a semiconductor die. A first group of vertical interconnectors disposed in a first bridge die included in a first sub-package of the sub-packages and other vertical interconnectors connected to the first group of vertical interconnectors constitute a first electric path, and a second group of vertical interconnectors disposed in a second bridge die included in a second sub-package of the sub-packages and other vertical interconnectors connected to the second group of vertical interconnectors constitute a second electric path. The first and second electric paths are electrically isolated from each other and disposed to provide two separate electric paths.


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