The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2021
Filed:
Jan. 30, 2018
Yasa Limited, Kidlington, GB;
Simon David Hart, Powys, GB;
Tim Woolmer, Waterperry, GB;
Christopher Stuart Malam, Powys, GB;
Graham Law, Powys, GB;
Francesca Bernardine Bumpus, Shrewsbury, GB;
YASA LIMITED, Kidlington, GB;
Abstract
The present invention relates to a semiconductor cooling arrangement for cooling semiconductor devices, such as power semiconductors. The semiconductor cooling arrangement comprises one or more semiconductor assemblies located in a chamber within a housing. The housing comprises inlet and outlet ports for receiving and outputting a cooling medium. The chamber is flooded with a cooling medium to cool the assemblies. The assemblies themselves each comprise a heatsink and one or more semiconductor power devices thermally coupled to the heatsink. The heatsink comprises heat exchanging elements in the form of a plurality of holes in the heatsink extending through the heatsink from one surface to another surface such that the cooling medium flows through the holes to extract heat from the heatsink.