The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Aug. 27, 2018
Applicant:

Toshiba Memory Corporation, Tokyo, JP;

Inventors:

Fumito Shoji, Yokkaichi Mie, JP;

Tatsuo Migita, Nagoya Aichi, JP;

Masahiko Murano, Yokkaichi Mie, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 18/16 (2006.01); C25D 5/02 (2006.01); H01L 21/67 (2006.01); C25D 17/00 (2006.01); H01L 21/288 (2006.01); C25D 7/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02021 (2013.01); C23C 18/1628 (2013.01); C23C 18/1664 (2013.01); C25D 5/02 (2013.01); C25D 7/12 (2013.01); C25D 17/004 (2013.01); C25D 17/005 (2013.01); H01L 21/288 (2013.01); H01L 21/6723 (2013.01); H01L 21/67253 (2013.01);
Abstract

An electrolytic plating apparatus includes a plating tank that is filled with plating liquid; a moving mechanism configured to vertically move a processing target substrate in a direction normal to a surface of the plating liquid; a seal member that is disposed at a peripheral edge portion of a processing target surface of a processing target substrate and is configured to seal the plating liquid to a center side of the processing target surface when the processing target substrate is immersed in the plating tank; and a contact member that is separated from the seal member and is electrically connected to the processing target surface.


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