The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Nov. 06, 2019
Applicant:

Superc-touch Corporation, New Taipei, TW;

Inventors:

Hsiang-Yu Lee, New Taipei, TW;

Shang Chin, New Taipei, TW;

Ping-Tsun Lin, New Taipei, TW;

Chia-Hsun Tu, New Taipei, TW;

Assignee:

SUPERC-TOUCH CORPORATION, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); H05K 9/00 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0002 (2013.01); G06K 9/00053 (2013.01); H01L 27/0248 (2013.01); H05K 9/0067 (2013.01);
Abstract

The present invention provides a fingerprint detection device, including: a substrate, a switch circuit layer, a sensing electrode layer, a heat dissipating antistatic structure layer, and a protective layer. The switch circuit layer is disposed on the substrate. The sensing electrode layer is disposed on the switch circuit layer, and includes a plurality of sensing electrodes. The heat dissipating antistatic structure layer is disposed on the sensing electrode layer, and includes a conductive mesh and a plurality of shunt heat sinks. The conductive mesh is formed with a plurality of mesh openings, and configured to shunt charges. The shunt heat sinks are adjacent to the conductive mesh, and correspond to the sensing electrodes. The shunt heat sinks are electrically insulated from each other, electrically insulated from the conductive mesh, and electrically insulated from the sensing electrodes. The protective layer is disposed on the heat dissipating antistatic structure layer.


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