The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Jan. 23, 2015
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Hiromi Fujita, Tokyo, JP;

Toshikazu Kawahara, Tokyo, JP;

Yoshihiro Ota, Tokyo, JP;

Shigeki Sukegawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01); G06F 30/00 (2020.01); G06F 30/398 (2020.01);
U.S. Cl.
CPC ...
G06F 30/00 (2020.01); G05B 19/41865 (2013.01); G05B 19/41875 (2013.01); G06F 30/398 (2020.01); G05B 2219/37448 (2013.01); Y02P 90/02 (2015.11);
Abstract

The purpose of the present invention is to provide a recipe creation device, with the goal of using past recipe data in order to highly efficiently create recipes. As an embodiment with which to achieve this goal, there is provided a recipe creation device comprising an arithmetic processing device that, on the basis of design data for a semiconductor element, establishes measurement conditions or inspection conditions by a semiconductor measurement device or a semiconductor inspection device, wherein the arithmetic processing device is configured to be able to access a database in which the measurement conditions or inspection conditions, and the pattern information of the semiconductor element, are stored in associated form, and the measurement conditions or inspection conditions are selected through a search using pattern information of the semiconductor element.


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