The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Aug. 15, 2019
Applicant:

Tpk Advanced Solutions Inc., Xiamen, CN;

Inventors:

Qi-Bin Liu, Fujian, CN;

You-Zhi She, Fujian, CN;

Kuo-Lung Fang, Hsinchu County, TW;

Jun-Rong Chen, Hsinchu County, TW;

Shih-Hao Chen, Hsinchu County, TW;

Jun-Ping Yang, Fujian, CN;

Xiao-Xia You, Fujian, CN;

Qi-Jun Zheng, Fujian, CN;

Jun-Jie Zheng, Fujian, CN;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0444 (2019.05); G06F 3/0414 (2013.01); G06F 2203/04103 (2013.01);
Abstract

A touch module includes a touch panel unit, a conductive adhesive layer and a circuit board. The touch panel unit includes a substrate, a touch sensing structure disposed on the substrate, a signal transmitting structure disposed on the substrate and electrically connected to the touch sensing structure, and a protection layer covering a part of a surface of the signal transmitting structure. The protection layer and the substrate are disposed at two opposite sides of the signal transmitting structure. The conductive adhesive layer has a main portion which covers a region of the signal transmitting structure on which the protection layer is not disposed, and a cover portion which extends from the main portion and covers the protection layer. The circuit board is disposed on the conductive adhesive layer, and the circuit board and the signal transmitting structure are disposed at two opposite sides of the conductive adhesive layer.


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