The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2021
Filed:
Jan. 25, 2018
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01K 7/00 (2006.01); G01K 7/22 (2006.01); H01C 17/065 (2006.01); H01C 7/04 (2006.01); H01C 7/02 (2006.01); H01C 7/00 (2006.01); H01C 17/28 (2006.01); H01C 1/142 (2006.01);
U.S. Cl.
CPC ...
G01K 7/223 (2013.01); H01C 7/005 (2013.01); H01C 7/008 (2013.01); H01C 7/027 (2013.01); H01C 7/049 (2013.01); H01C 17/06526 (2013.01); H01C 17/06553 (2013.01); H01C 17/06586 (2013.01); H01C 17/281 (2013.01); H01C 1/142 (2013.01); H01C 7/02 (2013.01); H01C 7/04 (2013.01);
Abstract
A temperature sensor that includes a first electrode layer, a second electrode layer, and a thermistor layer between the first and second electrode layers. The thermistor layer includes a spinel-type semiconductor ceramic composition powder containing Mn, Ni, and Fe, and an organic polymer component. In the semiconductor ceramic composition powder, the molar ratio of Mn to Ni is 85/15≥Mn/Ni≥65/35, and when the total molar quantity of Mn and Ni is 100 parts by mole, the content of Fe is 30 parts by mole or less, and the semiconductor ceramic composition powder is 2 μm or less in particle size.