The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2021
Filed:
May. 23, 2016
The Johns Hopkins University, Baltimore, MD (US);
Saertex Usa, Llc, Huntersville, NC (US);
Kevin J. Hemker, Reisterstown, MD (US);
Timothy P. Weihs, Baltimore, MD (US);
Stephen Ryan, Towson, MD (US);
Longyu Zhao, Baltimore, MD (US);
Seunghyun Ha, Nam-gu Busan, KR;
Yong Zhang, Baltimore, MD (US);
Sen Lin, Baltimore, MD (US);
James K. Guest, Lutherville Timonium, MD (US);
Keith Sharp, Huntersville, NC (US);
The Johns Hopkins University, Baltimore, MD (US);
Saertex USA, LLC, Huntersville, NC (US);
Abstract
The present invention is directed to devices formed from three dimensional (3D) structures composed of wires, yarns of wires, or 3D printed structures. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, using optimization within the 3D manufacturing constraints. The 3D structures of the present invention include multiple properties that are optimized for heat transfer applications. The present invention also includes the methods for optimization of the 3D woven lattices as well as methods of use of the 3D woven lattices in heat transfer applications.