The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Dec. 26, 2019
Applicant:

Celsia Technologies Taiwan, Inc., Taoyuan County, TW;

Inventors:

George A. Meyer, IV, Morgan Hill, CA (US);

Chien-Hung Sun, Taoyuan County, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); F28F 3/04 (2006.01); H05K 7/20 (2006.01); F28D 1/03 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0275 (2013.01); F28D 15/0233 (2013.01); F28F 3/042 (2013.01); H05K 7/202 (2013.01); H05K 7/20127 (2013.01); H05K 7/20336 (2013.01); F28D 1/035 (2013.01); F28D 1/0383 (2013.01); F28F 3/044 (2013.01); F28F 3/046 (2013.01);
Abstract

A heat pipe with a non-condensable gas includes a thermal conductor, and a working fluid and a non-condensable gas filled into a hollow chamber of the thermal conductor, and the thermal conductor has a heat-absorbing side attached to a heat-generating electronic component and an exothermal side attached to a radiator, and the exothermal side has at least one protrusion, and the exothermal side with the protrusion can reduce the contact area with the radiator, and the heat pipe lowers the conduction efficiency by the non-condensable gas and the protrusion, so as to achieve a work efficiency of the heat-generating electronic component in an operation within a working temperature range.


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