The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2021
Filed:
Jun. 26, 2019
Applicant:
Skyworks Solutions, Inc., Irvine, CA (US);
Inventor:
Kezia Cheng, Lowell, MA (US);
Assignee:
Skyworks Solutions, Inc., Irvine, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/50 (2006.01); H01L 21/3065 (2006.01); H01L 21/67 (2006.01); H01L 21/30 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); C23C 16/06 (2006.01); C23C 16/50 (2006.01); C23C 16/505 (2006.01);
U.S. Cl.
CPC ...
C23C 14/50 (2013.01); C23C 16/06 (2013.01); C23C 16/50 (2013.01); C23C 16/505 (2013.01); H01L 21/0217 (2013.01); H01L 21/02299 (2013.01); H01L 21/30 (2013.01); H01L 21/3065 (2013.01); H01L 21/31116 (2013.01); H01L 21/6715 (2013.01); H01L 21/67069 (2013.01); H01L 21/67757 (2013.01); H01L 21/6875 (2013.01);
Abstract
Methods to improve front-side process uniformity by back-side metallization are disclosed. In some implementations, a metal layer is deposited on the back-side of a wafer prior to performing a plasma-based process on the front side of the wafer. Presence of the back-side metal layer reduces variations in, for example, thickness of a deposited and/or etched layer resulting from the plasma-based process.