The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

May. 03, 2018
Applicants:

Ntt Advanced Technology Corporation, Kawasaki, JP;

Mipox Corporation, Shinjuku-ku, JP;

Inventors:

Kenji Aoki, Kawasaki, JP;

Naoki Sugita, Kawasaki, JP;

Toshihiro Igawa, Shinjuku-ku, JP;

Mitsunobu Shishido, Shinjuku-ku, JP;

Assignees:

NTT Advanced Technology Corporation, Kawasaki, JP;

Mipox Corporation, Shinjuku-ku, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 19/22 (2006.01); B24B 19/00 (2006.01); B24B 21/00 (2006.01); B24B 51/00 (2006.01); B24D 11/04 (2006.01); B24B 47/12 (2006.01); B24D 13/14 (2006.01);
U.S. Cl.
CPC ...
B24B 19/226 (2013.01); B24B 19/00 (2013.01); B24B 21/00 (2013.01); B24B 21/002 (2013.01); B24B 47/12 (2013.01); B24B 51/00 (2013.01); B24D 11/04 (2013.01); B24D 13/145 (2013.01);
Abstract

A polishing method and a polishing film are provided for automatically performing multi-stage batch polishing on an end surface of a workpiece. An end surface of a workpiece and a polishing plate are moved relative to each other while bringing the end surface of the workpiece into contact with a polishing film of the polishing plate. The end surface is moved in a circular motion with a diameter 2 R relative to the polishing film; the center of the circular motion is moved linearly by a distance S on the polishing film; the polishing film is provided with first, second, and third polishing surfaces; and the polishing film is further provided with cleaning surfaces between the polishing surfaces so that the range of the distance S in which one rotation in the circular motion crosses over different polishing surfaces is reduced, or does not cross over different polishing surfaces.


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