The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Feb. 28, 2017
Applicants:

Mitsubishi Heavy Industries Aero Engines, Ltd., Aichi, JP;

Osaka Yakin Kogyo Co. Ltd., Osaka, JP;

Inventors:

Kenji Suzuki, Tokyo, JP;

Kentaro Shindo, Tokyo, JP;

Shuntaro Terauchi, Osaka, JP;

Hisashi Kitagaki, Osaka, JP;

Kazuki Hanami, Osaka, JP;

Tadayuki Hanada, Aichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/16 (2006.01); B22F 3/22 (2006.01); C22C 1/00 (2006.01); C22C 14/00 (2006.01); C22C 1/04 (2006.01); B22F 3/10 (2006.01); C22C 21/00 (2006.01);
U.S. Cl.
CPC ...
B22F 3/16 (2013.01); B22F 3/1017 (2013.01); B22F 3/225 (2013.01); C22C 1/00 (2013.01); C22C 1/0416 (2013.01); C22C 1/0458 (2013.01); C22C 1/0491 (2013.01); C22C 14/00 (2013.01); C22C 21/003 (2013.01); B22F 2301/052 (2013.01); B22F 2301/205 (2013.01); B22F 2998/10 (2013.01);
Abstract

A method is for producing a TiAl-based intermetallic sintered compact. The method includes mixing Ti powder, Al powder, and a binder to yield a mixture; molding the mixture into a molded product having a predetermined shape with a metal injection molder; placing the molded product in a preliminary sintering die having a storage space inside; performing sintering at a predetermined preliminary sintering temperature to produce a preliminary sintered compact; releasing the preliminary sintered compact from the preliminary sintering die; and performing sintering at a sintering temperature higher than the preliminary sintering temperature to form the TiAl-based intermetallic sintered compact.


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