The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2021
Filed:
Oct. 24, 2017
Daihen Corporation, Osaka, JP;
Osaka Research Institute of Industrial Science and Technology, Izumi, JP;
Ryusuke Tsubota, Osaka, JP;
Yohei Oka, Osaka, JP;
Akira Okamoto, Osaka, JP;
Takayuki Nakamoto, Izumi, JP;
Takahiro Sugahara, Izumi, JP;
Naruaki Shinomiya, Izumi, JP;
Mamoru Takemura, Izumi, JP;
Sohei Uchida, Izumi, JP;
DAIHEN CORPORATION, Osaka, JP;
Osaka Research Institute of Industrial Science and Technology, Izumi, JP;
Abstract
A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.