The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Oct. 11, 2016
Applicant:

The Swatch Group Research and Development Ltd, Marin, CH;

Inventors:

Tommy Carozzani, Neuchatel, CH;

Yves Winkler, Schmitten, CH;

Alban Dubach, Bienne, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22D 27/04 (2006.01); B22D 13/00 (2006.01); B22D 17/00 (2006.01); B22D 25/02 (2006.01); B22D 15/00 (2006.01); G04B 17/22 (2006.01); B22C 9/02 (2006.01); A44C 27/00 (2006.01); G04B 15/14 (2006.01); G04B 17/28 (2006.01); G04B 19/04 (2006.01);
U.S. Cl.
CPC ...
B22D 27/04 (2013.01); B22C 9/02 (2013.01); B22D 13/00 (2013.01); B22D 15/00 (2013.01); B22D 17/00 (2013.01); B22D 25/026 (2013.01); G04B 17/227 (2013.01); A44C 27/003 (2013.01); G04B 15/14 (2013.01); G04B 17/285 (2013.01); G04B 19/042 (2013.01);
Abstract

A method for manufacturing a micromechanical component made of a first material, the first material being a material that can become at least partially amorphous, the method including: a) providing a mold made of a second material, the mold including a cavity forming the negative of the micromechanical component; b) providing the first material and forming the first material in the cavity of the mold, the first material having undergone, at a latest at a time of the forming, treatment allowing the first material to become at least partially amorphous; c) separating the micromechanical component thus formed from the mold.


Find Patent Forward Citations

Loading…