The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2021
Filed:
Sep. 10, 2018
Shenzhen Mindray Bio-medical Electronics Co., Ltd., Shenzhen, CN;
Cong Xu, Shenzhen, CN;
Bingyin Wang, Shenzhen, CN;
Yangbo Liu, Shenzhen, CN;
Zhigang Hu, Shenzhen, CN;
Zhonghua Liu, Shenzhen, CN;
SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS CO., LTD., Shenzhen, CN;
Abstract
A sensor assembly includes a housing and a circuit board assembly. The housing includes a first accommodation cavity, a second accommodation cavity, a first connection portion, a second connection portion, and a third accommodation cavity. The first connection portion is connected to the first accommodation cavity and one end of the third accommodation cavity, and the second connection portion is connected to the second accommodation cavity and the other end of the third accommodation cavity. The circuit board assembly is accommodated within the first accommodation cavity, the second accommodation cavity, the first connection portion, the second connection portion and the third accommodation cavity. The width of the first connection portion and the second connection portion is less than the width of the first accommodation cavity, the second accommodation cavity and the third accommodation cavity. The first connection portion and the second connection portion are each provided with a buffer groove along the width direction.