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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10980119 B1

PDFFull Text
Date of Patent:
Apr. 13, 2021

Filed:

Aug. 15, 2019

Display device and method of manufacturing the same

Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Junwoo You, Seongnam-si, KR;

Atsushi Nemoto, Suwon-si, KR;

Byoungdae Ye, Yongin-si, KR;

Taeho Lee, Hwaseong-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:

Lewis Roca Rothgerber Christie LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/42 (2006.01); G02F 1/13 (2006.01); G02F 1/1333 (2006.01); G02F 1/1335 (2006.01); G02F 1/1343 (2006.01); G02F 1/1339 (2006.01); G02F 1/1362 (2006.01); H01L 21/00 (2006.01); H01L 21/50 (2006.01); H01L 21/768 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01); H01L 29/04 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/147 (2013.01); H05K 1/113 (2013.01); H05K 1/189 (2013.01); H05K 3/363 (2013.01); H05K 3/4038 (2013.01); H05K 2201/098 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10136 (2013.01); H05K 2203/085 (2013.01); H05K 2203/107 (2013.01);
Abstract

A display device and a method of manufacturing the display device are capable of substantially minimizing damage to a display panel. The display device includes: a first substrate including a display area and a pad area; a polarization film disposed at an upper surface of the first substrate to overlap the display area; a flexible printed circuit board disposed at a lower surface of the first substrate; a via hole defined through the first substrate at the pad area; and a connection metal located at the via hole. The connection metal includes a connection portion disposed in the via hole and a first protruding portion that protrudes with respect to the first substrate, and the polarization film is spaced apart from the via hole in a plan view.

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