The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Jul. 24, 2018
Applicants:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Sumitomo Electric Printed Circuits, Inc., Shiga, JP;

Inventors:

Eiko Imazaki, Osaka, JP;

Koji Nitta, Osaka, JP;

Kousuke Miura, Osaka, JP;

Shoichiro Sakai, Osaka, JP;

Kenji Takahashi, Osaka, JP;

Masahiro Matsumoto, Osaka, JP;

Hirohisa Saito, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/112 (2013.01); H05K 3/422 (2013.01); H05K 3/423 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09563 (2013.01);
Abstract

A printed circuit board according to one embodiment of the present invention is a printed circuit board including a plate-shaped or a sheet-shaped insulating material having a penetrating hole, and a metal plating layer layered on both surfaces of the insulating material and an inner peripheral surface of the insulating material, wherein an inner diameter of the penetrating hole monotonically decreases from a top surface of the insulating material toward a back surface, and wherein the inner diameter of the penetrating hole at a center in a thickness direction of the insulating material is smaller than an average of an opening diameter on the top side and an opening diameter on the back side.


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