The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Mar. 27, 2019
Applicant:

Dr. Ing. H.c. F. Porsche Aktiengesellschaft, Stuttgart, DE;

Inventors:

Stefan Götz, Forstern, DE;

Eduard Specht, Bruchsal, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H05K 1/181 (2013.01); H05K 7/20927 (2013.01); H05K 7/205 (2013.01); H05K 7/20254 (2013.01); H05K 7/20509 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10522 (2013.01);
Abstract

A method for cooling power electronics circuits, in which a printed circuit board is produced according to a prescribed circuit board process and is populated with at least one power electronics components. Contact connecting at least one location on at least one metallic conductor track running on a surface of the printed circuit board that includes at least one metal element, which is both electrically conductive and heat-conductive and the physical height of which is designed to be at least as large as that of the at least one power electronics component. A cooling plate is placed in a planar manner onto the at least one power electronics component and/or the at least one metal element.


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