The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Feb. 08, 2018
Applicant:

Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;

Inventors:

Mingzhu Wang, Zhejiang, CN;

Zhongyu Luan, Zhejiang, CN;

Liefeng Chen, Zhejiang, CN;

Duanliang Cheng, Zhejiang, CN;

Bojie Zhao, Zhejiang, CN;

Takehiko Tanaka, Nara, JP;

Zhen Huang, Zhejiang, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2254 (2013.01); H04N 5/2253 (2013.01);
Abstract

The present invention provides a camera module, a molding photosensitive assembly thereof, a manufacturing method, and an electronic device, the molding photosensitive assembly comprises a lens, a photosensitive element, a circuit board, a molding base, and a supporting element, the photosensitive element being arranged on the circuit board, the molding base being formed into an integral structure with the lens, the supporting element, the photosensitive element, and the circuit board by means of a molding process, and the camera module and the molding photosensitive assembly thereof being capable of reducing stain sensitivity and shortening the distance of the lens plane above a light through hole of the lens to the photosensitive plane of the photosensitive element.


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