The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Sep. 24, 2018
Applicant:

Lenovo (Beijing) Co., Ltd., Beijing, CN;

Inventors:

Qian Zhao, Beijing, CN;

Heng Liu, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 27/26 (2006.01); H01Q 1/24 (2006.01); H03K 17/955 (2006.01); H04B 1/10 (2006.01); H01Q 21/28 (2006.01); H04B 1/3827 (2015.01); H04L 5/14 (2006.01); H03K 17/96 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/245 (2013.01); H01Q 21/28 (2013.01); H03K 17/955 (2013.01); H04B 1/1027 (2013.01); H04B 1/3838 (2013.01); H03K 2017/9613 (2013.01); H04L 5/14 (2013.01);
Abstract

An electronic apparatus and an information processing method are provided. The apparatus includes a main body, a first electronic component and a second electronic component, having a common function and disposed at different positions in relation to the main body, and a controller, disposed in relation to the main body. The controller is connected to the first electronic component through a first connection wire and the controller is also connected to the second electronic component through a second connection wire. The first connection wire has a length longer than the second connection wire. The apparatus further includes a reference wire, connected to the controller, in order to provide reference data corresponding to the first connection wire to the controller. The controller is configured to adjust detection data received from the first electronic component via the first connection wire, based on the reference data of the reference wire.


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