The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Feb. 05, 2018
Applicants:

Imec Vzw, Leuven, BE;

Universiteit Hasselt, Hasselt, BE;

Inventors:

Marc Meuris, Keerbergen, BE;

Tom Borgers, Leuven, BE;

Bart Onsia, Schaarbeek, BE;

Assignee:

IMEC vzw, Leuven, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/05 (2014.01); H01L 31/0468 (2014.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/05 (2013.01); H01L 31/0468 (2014.12); H01L 31/186 (2013.01);
Abstract

Example embodiments relate to partially translucent photovoltaic modules and methods for manufacturing partially translucent photovoltaic modules. One embodiment includes a method for electrically interconnecting a plurality of thin-film photovoltaic plates. The method includes positioning a plurality of thin-film photovoltaic plates side by side. The thin-film photovoltaic plates are partially translucent or non-translucent. The method also includes providing at least one connection element on a surface of each of the plurality of thin-film photovoltaic plates. The at least one connection element includes a plurality of electrically conductive wires arranged in a grid structure. Further, the method includes physically separating each connection element into a first connection part that includes a plurality of first electrically interconnected, conductive wires and a second connection part that includes a plurality of second electrically interconnected, conductive wires. In addition, the method includes providing busbars and forming electrical busbar connections.


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